General purpose sealing silicone Sikasil Universal
Sikasil Universal is suitable for sealing glazing and sealing with environmental ageing resistance requirements on non-porous substrates such as glass and glazed ceramic tiles
Benefits
- Low modulus of elasticity
- High elasticity and flexibility
- Very good resistance to shrinkage, cracking and discolouration
- Very good adhesion to a wide range of non-porous substrates
Characteristics
- Composition Acetoxy (acetate) silicone
- Density ~ 1,0 kg/l
- Shore A hardness ~ 20 (after 28 days)
- Tensile strength ~ 1,7 N/mm2
- Modulus of elastic deformation ~ 0,35 N/mm2 at 100% elongation (23 °C)
- Elastic recovery > 90%
- Tear propagation resistance ~ 1,9 N/mm
- Mobility ± 20%
- Operating temperature -40 °C to +100 °C
Application
- The substrate must be clean, dry, stable, homogeneous, free from grease, dust and loose parts. Paints, cement laitance and other materials with low adhesion should be removed.
- Sikasil Universal is adhered without primers and/or activators. However, for optimum adhesion and in critical applications, e.g. applications in high-rise buildings, high-stress welds, in cases of exposure to extreme weather conditions or immersion in water, the following priming and/or substrate preparation procedures should be used:
- Aluminum, anodized aluminum, stainless steel, galvanized steel, electrostatically painted metals or glazed tiles should be cleaned and prepared with Sika Aktivator-205 applied to a clean cloth. Before sealing, allow a drying time of > 15 minutes (< 6 hours).
- Other metals such as copper, brass and titanium-zinc should also be cleaned and prepared with Sika Aktivator-205 applied to a clean cloth. After the drying time has been observed, apply Sika Primer-3 N with a brush and observe an additional additional drying time of > 30 minutes (< 8 hours) before sealing. Glass substrates should be cleaned with isopropyl alcohol prior to application.
- Curing flow Ambient temperature +5 °C to +40 °C, at least 3 °C above dew point
- Substrate temperature +5 °C to +40 °C
- Cure rate ~ 3,0 mm/24 hours (23 °C / 50% S.H.)
- Cuticle formation time ~ 15 minutes (23 °C / 50 % S.W.)